"

EBET真人-平台首页

<tt id="bm158"><form id="bm158"></form></tt>
    <cite id="bm158"></cite><tt id="bm158"></tt>

    <tt id="bm158"><noscript id="bm158"></noscript></tt>
  1. <rp id="bm158"></rp>
    <cite id="bm158"><noscript id="bm158"></noscript></cite>
    "
    
    

    返回首页 | 中文 | 英文

    CP12 prober当前位置:首页  >>  产品展示

    CP12 prober

     

    Item

    CP12 prober

    Dimension

    1620mm(W) *1230D*1450mm(H)

    Wafer

    200mm,300mm

    Wafer thickness

    250~2000μm

    Die Size

    350μm ~76,000μm

    Transfer mode

    Vacuum suction, dual arms

    Accuracy

    XY±1.5μm;Z±2.5μm

    XY platform

    Probing area ± 170mm, repeated positioning accuracy ± 1μm

    Z axis

    Repeated positioning accuracy ± 1.5μm, max speed 30mm/s

    Force

    50kg (optional 200kg)

    Calibration

    Image calibration, with high/low–power template

    Index time

    240ms (based on die size 6mm,Z clearance 0.5mm)

    Test temperature

    Ambient~150±1

    Communication interface

    GPIB, reserved TTL and RS232

    Option

    ID reading, auto card exchange

    Refer to the prober for CIS and SOC device.

     

    版权所有:杭州长川科技股份有限公司 地址:杭州市滨江区聚才路410号

    电话:+86-571-85096193 传真:+86-571-88830180 技术支持:故乡人网络 浙ICP备13037257号-1

    "EBET真人-平台首页 <tt id="bm158"><form id="bm158"></form></tt>
      <cite id="bm158"></cite><tt id="bm158"></tt>

      <tt id="bm158"><noscript id="bm158"></noscript></tt>
    1. <rp id="bm158"></rp>
      <cite id="bm158"><noscript id="bm158"></noscript></cite>
      "